1775337-1 datasheet

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О ДАТАШИТЕ

• Маркировка
  1775337-1
• Производитель
  TE Connectivity
• Описание
  TE Connectivity 1775337-1 Boss: With Centerline (mm [in]): 0.80 [0.031] Contact Base Material: Phosphor Bronze Contact Plating, Mating Area, Material: Gold Flash Ejector Location: None Ejector Type: Standard Housing Material: Thermoplastic - GF Insertion Style: Direct Insert Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Module Orientation: Right Angle Mount Type: Printed Circuit Board Number Of Positions: 52 Number Of Rows: Dual Packaging Method: Tape & Reel Packaging Quantity: 600 Pcb Mount Style: Surface Mount Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 6.20 [0.244] Socket Style: Mini PCI Socket Type: Memory Card Stack Height (mm [in]): 5.20 [0.205]
• Количество страниц
  4 шт.
• Форматы файла
  HTML, PDF

  (Для просмотра требуется Adobe Acrobat Reader)

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